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印制光—电路板的发展评述(4)——印制光—电路板的测试(2) 被引量:1

Review of Progress in Optical-Electronic Circuit Boards (4)——Test Methods for OE-PCB (Part2)
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摘要 在波导制备过程中经常需要进行淀积膜的形貌观察,如膜的表面起伏、波导侧壁的粗糙度和波导的断面形状等。扫描电子显微镜(SEM)和原子力显微镜(AFM)是这种形貌观察最常用的工具。AFM结合了指针轮廓仪和扫描隧道显微镜(STM),利用针尖在样品表面作光栅扫描,得到表面的三维轮廓图,可以分析出表面起伏的数值,但是当波导厚度大于2μm时,探测的针尖不能准确探测到波导根部,这样,制作出的矩形波导就会被探测成梯形,图18为55×65μm^2间距为125μm的激光烧蚀波导阵列的显微镜图像。
作者 张家亮
出处 《印制电路信息》 2007年第5期13-16,62,共5页 Printed Circuit Information
基金 江苏省科技厅科技发展计划资助 项目编号为BG2005011。
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参考文献22

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