摘要
面对电子制造业对有铅到无铅焊接的转变,文章提出处理两者同时存在时如何选则焊接工艺,并通过试验及各种检测手段,分析了混合焊接的焊点结构,得出了相应的可行性方案。
Considering the change of lead solder to lead-flee in electronic manufacturing industry, the method of how to choose solder craft when both exist at the same time is presented in this paper. An analysis of the mixed solder structure is got by experiment and kinds of examinations, finally the relevant feasible project is obtained.
出处
《印制电路信息》
2007年第5期59-62,共4页
Printed Circuit Information
关键词
无铅工艺
金相
能谱
lead-free craft
microsection
EDX（x-ray energy dispersive spectrometer）
