热浸镀铝钢Al_2O_3/渗铝层界面空洞生长动力学研究

Growth Kinetics of Voids Along Interface Between Al_2O_3 and Aluminized Layer of Aluminized Steel

通过高温氧化实验和SEM,XRD分析,研究了热浸镀铝钢在1000℃氧化期间Al2O3/渗铝层界面空洞的生长过程,分析了界面空洞的生长机理。结果表明,界面空洞的生长受氧化过程制约,生长速度与渗铝层表面的氧化速度存在一定的对应关系,生长动力学遵循近似的抛物线规律;随氧化时间延长,单位面积上的空洞数量先快速增加而后逐渐减少。

The growth process of voids along the interface betweenAl2O3 and aluminized layer during oxidation at 1000℃ was investigated by high temperature oxidation test and scanning electron microscopy （SEM）,X-ray diffractometer （XRD）. The growth mechanism of interfacial voids was also discussed. The results showed that the growth of interfacial voids was controlled by oxidation process and where were corresponding relations between growth rate of the voids and oxidation rate of the surface for aluminized layer. The growth kinetics of interfacial voids accorded with a parabola growth rule and number of voids in unit area first increased quickly and then declined gradually with oxidation time.