摘要
在总结本厂某产品试制工艺的基础上，就细间距的焊膏漏印模板的几种加工方法、模板开口、模板开口侧壁的形状与要求进行了比较与说明。
This paper makes comparison and explanation on processing methods of solder paste printing stencil,stencil aperture,requirements and shapes of stencil aperture wall for fine pitch technology based on the generaligation of the pilot process of a specific product in our company.The paper also summariges the requirements on fine-pitch solder paste inherent quality and paste process features.
出处
《电子工艺技术》
1997年第1期22-25,共4页
Electronics Process Technology
关键词
细间距器件
焊膏
漏印模板
焊料球
印制板
Fine pitch devices Solder paste pritting stencil Fine pitch solder paste Solder ball
