摘要
论述了目前高密度封装和 MCM 的现状。指出目前高密度封装和 MCM 技术正在从数字电路向模拟电路尤其是微波电路转移,并例举了几种常见的微波 MCM。还论述了近年来我所研制的一些微封装、微组装的典型产品。
This paper describes the current status of MCM,and points out that at pre- sent the high-density packaging and MCM technologies are transferring from digital cir- cuit to anologue circuit,especially to microwave circuit.And some microwave MCMs are exemplified.Furthermore some typical products of micropackage and microassembly de- veloped in our Institute in recent years are addressed.
出处
《半导体情报》
1997年第1期1-8,共8页
Semiconductor Information
关键词
多芯片组件
封闭
微组装
MCM
High density packaging
Microassembly
