一种芯片焊盘自动识别方法及其应用

A Method of Automatic Recognition of Bonding Pad and its Application

介绍了采用图像处理和模式识别的方法对一幅半导体芯片的图像进行焊盘的识别和定位。这一技术可以广泛应用于微电子行业中的芯片封装技术,它的核心是实现了对未封装的半导体芯片上的焊盘进行识别并定位的视觉机器。给出了用计算机对算法进行仿真后的实验结果。

This paper introduces how to recognize and locate the bonding pad from a silicon chip image with the method of Digital Image Processing and Pattern Recognition. This technology can be widely used for chip encapsulation in the field of micro-electronics. The core of this technology is that it achieves a vision machine to automatically recognize and locate the bonding pad on the unencapsulated semiconductor chip. The experimental results of computer emulated algorithm are also included in this paper.