摘要
介绍了RFID芯片封装设备中,晶圆的识别与定位技术。其识别过程主要是在击中击不中变换后,使用基于二值图像像素的快速标记算法识别晶圆,因此在原有的连通体检测算法的基础上,作了相应的改进,使其没有复杂的数据结构,减少计算量,简单易行。定位过程是在晶圆识别后,计算出晶圆的质心,再对质心进行合理的排序,计算当前晶圆和下一晶圆的距离,传给电机,带动晶圆盘移动。
The paper mainly introduces the technology of recognition and alignment of wafers of the RFID packaging. The recognition of wafer is based on the algorithm for pixel labeling in the binary images. The improvement is made on the existed algorithms for detecting of connected components so that the current algorithm has few complex data structure,and is easy for caculating. After the recognition of wafers, the process of alignment counts out the centroids of the wafers, then sorts the centroids and calculates the distance between the current wafer and next wafer. Receiving the data of distance, the motors move the wafer plate.
出处
《机械与电子》
2007年第5期58-61,共4页
Machinery & Electronics
关键词
晶圆
识别
定位
击中击不中变换
标记
连通体
wafer
recognition
alignment
hit - miss transform
labeling
connected component
