电子封装陶瓷基片材料研究现状

Recent Achievement in Research for Electronic Packaging Ceramic Substrate Materials

阐述了电子封装领域对基片材料的基本要求,分析了几种常用的陶瓷基片材料的性能特点,论述了电子封装陶瓷基片材料的研究现状,并指出了发展方向。

Reviews the elemental requirements for electronic packaging substrate materials, and analyses the characteristics of some common ceramics substrate used for electronic packaging, and discusses the rencent achievements in the research for electronic packaging ce- ramic substrate materials.