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Co/Cu纳米多层膜的电化学制备及其微观结构的表征 被引量:6

Electrochemical preparation and microstructural characterization of Co/Cu nanomultilayer
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摘要 以(110)高择优的Cu片为基底,在硫酸盐镀液中采用单槽双脉冲控电位电沉积法制备了Co/Cu纳米多层膜。采用X射线衍射(XRD)和扫描电镜(SEM)分别对多层膜的微观结构和形貌进行了表征。结果表明,Co/Cu多层膜具有良好周期性,多层膜的微结构和表面形貌与表层的金属层紧密相关,也与Co和Cu镀层厚度及其相对厚度、周期数相关。硼酸的加入有利于改善Co/Cu多层膜的层状结构。 Co/Cu nanomultilayers were prepared on highly (ll0)-oriented copper substrate in a three-chamber cell containing sulfate by double-pulse potential-controlled electrodeposition. The microstructure and morphology of the nanomultilayers were examined by XRD and SEM, respectively. The nanomultilayers had a superlattice structure. The effects of the surface layer of nanomultilayers, thicknesses of Cu and Co layers, ratio of Cu layer thickness to Co layer thickness and bilayer number on microstructure and surface morphology of Co/Cu nanomultilayers were discussed. The microstructure and surface morphology of Co/Cu nanomultilayers are mainly affected by the surface layer ofnanomultilayers. The addition of boric acid to sulfate electrolyte improves the layered structure of Co/Cu nano-multilalers.
出处 《电镀与涂饰》 CAS CSCD 2007年第5期5-9,共5页 Electroplating & Finishing
基金 高等学校重点实验室访问学者基金资助项目(2005)。
关键词 Co/Cu纳米多层膜 电沉积 制备 微观结构 表征 Co/Cu nanomultilayer electrodeposition preparation microstructure characterization
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参考文献16

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