用正交试验方法优化Ni-P-SiC化学复合镀工艺

Optimization on the process of electroless Ni-P-SiC composite plating with orthogonal test

采用正交试验方法研究了SiC质量浓度、搅拌速度、温度、表面活性剂4因素对Ni–P–SiC化学复合镀镀层沉积速度和镀层显微硬度的影响。试验表明:温度对镀层沉积速度的影响最大,搅拌速度次之;SiC质量浓度对镀层显微硬度的影响最大,搅拌速度次之。当SiC质量浓度为7.5g/L,搅拌速度为240r/min,温度为90°C,混合添加阳离子表面活性剂和非离子表面活性剂时,镀层沉积速度达28.3μm/h,镀层显微硬度达756HV。经400°C热处理6h后镀层显微硬度达1250HV。按照优化方案施镀,镀层厚度均匀,微粒在镀层中分布均匀。

The effects of four factors （concentration of SiC particles, speed of particles mixing, temperature and surfactants） on the depositing rate and microhardness were studied with orthogonal test. Experiments show that the influence of temperature on deposition rate is biggest followed by mixing speed; the influence of the concentration of SiC particles on microhardness is biggest followed by mixing speed. Based on the optimized scheme, the deposition rate can be as high as 32.3μm/h, and the composite coating can reach a microhardness value of 756 HV. After heat treatment at 400℃ for 6 hours, the microhardness of the composite coating may reach 1250 HV. According to the optimized plan, the coating thickness is even and the particles distribute evenly in the coating.