摘要
研究了长时间再流焊条件下,在粉状Sn-9Zn无铅钎料中加入Cu颗粒增强质点(复合钎料)对Sn-9Zn/Cu钎焊接头界面反应的影响。结果表明,在Sn-9Zn无铅钎料中加入Cu颗粒,可有效降低Sn-9Zn/Cu钎焊接头界面金属间化合物(IMC)的生长速度,从而减小界面IMC层的厚度,减少IMC层内的柯肯达尔(Kirkendall)缺陷;IMC层的厚度随再流焊时间的增加而增加,随Cu颗粒加入量的增加而减小。在现试验条件下,IMC层由Cu-Zn金属间化合物组成,未检测到Cu-Sn金属间化合物的存在。
The influences of Cu-particle addition in Sn-9Zn lead-free solder powder(composite solder)on the interfacial reaction of Sn-9Zn/Cu joint were investigated under extended reflowing time conditions.The results show that Cu-particle addition in Sn-9Zn lead-free solder decreases dramatically the growing rate of the interfacial intermetallic compound(IMC)in Sn-9Zn/Cu joint,consequently which results in the reduction of the interfacial IMC layers and Kirkendall defect in the interfacial IMC layers.The thickness of IMC layers increases with increasing reflowing time and decreases with increasing Cu-particle content in Sn-9Zn lead-free solder.EDX analysis of IMC layer indicates that it is only composed of Cu-Zn intermetallic compounds there is no Cu-Sn intermetallic compounds to befound under existing test conditions.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2007年第5期105-108,共4页
Transactions of The China Welding Institution
