摘要
介绍了微电子机械系统的四种基本制作技术,即本体微机械加工、表面微机械加工、铸模工艺和晶片键合工艺。重点讨论了实现微系统突破的集成工艺技术。最后简单概述了传感器。
Four fundamental manufacturing technologies namely bulk micromachining,surface micromachining,moulding and wafer bonding are introduced for Micro Electro Mechanical System(MEMS).A Discussion is focused on integrated processes that will enableithe realization of MEMS breakthrough.Finally the recent advance of sensors,actuators and MEMS are summarized briefly.
出处
《半导体情报》
1997年第2期11-22,共12页
Semiconductor Information
关键词
本体微机械加工
微电子机械系统
半导体技术
Bulk micromachining Surface micromachining Micro Electro Mechanical System Sensor Actuator