改善引线框架材料表面特性的研究

IMPROVEMENT ON CHARACTERS OF SURFACE OF LEAD FRAME MATERIALS

研究探讨了改善半导体引线框架材料表面特性的方法。这种通过在高强度铜合金表面电解沉积一层纯铜层,然后再经过轧制和热处理的生产工艺,可获得与无氧铜相同的优良表面特性而又不降低母材强度的复合材料。

This paper discusses the methods for improving surface characters of semiconduc-tive lead frame. Electrolytic depositing a pure copper layer on surface high-strength copper alloys, rolling them and heat treatment, the production process can obtain same composite material with excellent surface character as non-oxidation copper but not reducing strength of composite material.