微晶CuCr50真空断路器触头材料的研制

Investigation of Contact Materials for Microcrystal CuCr50 Vacuum Breaker

采用高能球磨法制取ＣｕＣｒ５０合金粉，在真空炉内热压成致密块体，利用扫描电镜、Ｘ－ｒａｙ衍射仪、能谱仪等考察了球磨过程粉末粒度、形貌的变化，热压块体的显微组织以及其密度随温度。

CuCr50 alloy powder was made by high energy ball milling process and compacted into dense compact by hot pressing in vacuum furnace. The particle size, change of morphology, microstructure of hot pressed compact and its density change with temperature and time during milling process were reviewed by using scanning electronic microscope, X ray diffractometer, nelgy spectrometer, etc.