高密度组装用精细无铅焊膏相关材料及其关键制备技术

Fine Lead-free Solder Paste for High Density Packaging and Its Key-preparation

电子产品不断朝着小型化、低成本、多功能、超高互连密度（高的I／O）、高可靠以及便携等方向发展，使得其封装向着高度集成化、高性能化、多引线、多元化和窄间距化方向发展，这对组装技术和组装用连接材料都提出了更高的要求。本文概述了电子组装技术的发展历程，主要探讨了高密度组装用精细无铅焊膏相关材料及其制备技术，并着重讨论了焊膏基料一无铅焊粉的制备技术、发展现状及其发展趋势，并结合中国国情分析了中国无铅焊料的市场前景和企业前进方向。

With the Electronics and Electrical Appliances minimization, low-costing, multifunction, super-high density, reliability and convenience, the electronic packaging developing toward to high integration, high performance, multilead, narrow pinch. Which require higher assembly technology and muti-functional soldering material. The development process of electronic assembly technology is summarized. The pertinent materials and preparation technology of fine Pb-free solder paste used in the high density assembly are discussed introduced. Besides, the preparation technology, current status and development trend of Pb-free solder powder are. The market prospect of Pb-free solder materials and the direction of corporations are analyzed combining with the situation of China.