摘要
采用中频磁控反应溅射工艺进行氧化铝薄膜的沉积实验,对该工艺过程中溅射电压和沉积速率与氧流量的“迟滞回线”现象进行了研究。通过对实验现象的分析讨论,解释了薄膜沉积速率变化的原因。
Aluminum oxides films were grown by medium-frequency reactive magnetron sputtering. Hysteresis loop observed in the relationship between the sputtering voltage (or the film deposition rate) and the oxygen flow rate was studied. Influence of oxygen partial pressure on oxide layer in the sputtered areas on target surfaces may account for the change in film deposition rate
出处
《真空》
CAS
北大核心
2007年第3期32-35,共4页
Vacuum
基金
国家自然科学基金资助项目(50376067)
关键词
迟滞回线
反应溅射
中频溅射
氧化铝薄膜
hysteresis loop
reactive sputtering
medium-frequency sputtering
aluminum oxide film