摘要
利用Sewell的X射线激发深度公式建立起用电子探针测量有衬底纯元素薄膜厚度的应用软件;测量了Ti,Cu,Mo等四种厚度的薄膜标样的质量厚度,并对测量误差进行分析;最后给出了各种纯元素薄膜厚度的测量下限.
A software for determinating the thickness of thin metal film with EPMA was developed on the bass of Sewell's formula. It is based physically on that the exciting depth of X-ray decreased as the accelerate voltage of incident electron lowered. When the exciting depth is equal to the film depth, the ratio of X-ray intensities from film and bulk standard is unity. The thicknesses of several thin metal films of pure elements on Si and Al substrates were determined by this method, and the relative error of mass thickness is smaller than 1.6%.The minimum mass thicknesses for various elements, which can be measured, were also obtained.
出处
《金属学报》
SCIE
EI
CAS
CSCD
北大核心
1997年第4期443-448,共6页
Acta Metallurgica Sinica
基金
国家自然科学基金
关键词
电子探针
金属薄膜
质量
厚度
测量
软件
measurement software, electron probe microanalyser, thin film, mass thickness