化学镀镍-铜-磷三元合金层的制备及其组织与性能研究

Preparation of Electroless Plating Ni-Cu-P Ternary Alloy Deposition and Study on Its ,Microstructure and Property

对45钢表面用化学镀方法镀镍-铜-磷三元合金层,采用金相显微镜、扫描电镜能谱分析、X射线衍射和显微硬度计研究了镀层的组织、相结构和性能。结果表明,600℃×1h热处理后,镀层由Ni基固溶体、Ni3P和Cu3P化合物相组成;镀层的硬度随着热处理温度升高先增大后降低,400℃热处理后的硬度最高;在相同的模拟酸性腐蚀条件下,Ni-Cu-P三元合金化学镀层与1Cr18Ni9不锈钢相比,具有更加良好的耐腐蚀性能。

Ni-Cu-P ternary alloy was prepared on 45 steel by an electroless deposition and its microstructure,phase structure and properties were studied using optical microscope,energy dispersive analysis,X-ray diffraction and microhardness tester. The results show that the deposition layer is composed of Ni-base solid solution, Ni3P and Cu3P after heat treatment at 600℃ for lh; its microhardness is up first and down later with heat treatment temperature increasing, and reaches the highest hardness at400℃; Compared with 1Cr18Ni9 stainless steel, the electroless deposition Ni-Cu-P ternary alloy has much better corrosion resistance under the same condition of simulating acid-corrosion.