期刊文献+

向32nm迈进的光刻技术

Lithography Techniques for the Node of 32 nm
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摘要 概述了用于45nm节点的各种光刻技术发展现状及技术路线,结合国际半导体技术发展指南(ITRS)和各公司最新宣布的研究成果,探讨了各种光刻技术用于32nm节点的可能性。 The current status and lithography roadmap of ITRS 2006 is reviewed in this paper, The trends of lithography Techniques for the node of 32nm has been approached with the roadmap of ITRS and the newest results of research announced in SPIE 2006 Optical Microlithography symposium and IEDM 2007.
作者 童志义
出处 《电子工业专用设备》 2007年第4期8-16,共9页 Equipment for Electronic Products Manufacturing
关键词 浸液式光刻 折射率 双重曝光 极紫外光刻 纳米压印光刻 曝光设备 Immersion lithography Re,active Index EUVL Polarization Technology Dual Exposure Imprint Exposure Tool
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参考文献6

  • 1INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS 2006[R].UPDATE LITHOGRAPHY,2006.
  • 2Jan Mulkens,Bob Streefkerk,et.al.Defects,overlay,and focus performance improvements with five generations of immersion exposure systems[C].SPIE vol 6520,paper 652005 (2007).
  • 3Yasuhiro Ohmura,et.al.Current status of high-index immersion lithography development[C].SPIE vol 6520,paper 652006 (2007).
  • 4Eelco van Setten,Wim de Boeij,et.al.Pushing the boundary:low-kl extension by polarized illumination[C].SPIE vol 6520,paper 65200C (2007).
  • 5Mircea Dusa,et.al.Pitch doubling through dual-patterning lithography challenges in integration and litho budgets[C].SPIE vol 6520,paper 65200G (2007).
  • 6Harry Sewell,et.al.The next phase for immersion lithography[C].SPIE vol 6154 paper 615406 (2006).

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