期刊文献+

SB6键合机工艺腔净化过程的软件改进(英文)

Software Improvement at the Procedure of SB6 Chamber Purging
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摘要 分子泵是高真空系统的核心部件,通过对SB6键合机真空系统和分子泵特性的分析,总结讨论了3个可能导致分子泵损坏的键合工艺过程,最后,提出对工艺腔净化过程的一个软件改进办法,这个改进的思路对从事半导体设备维修的专业人员而言是有一定帮助的。 The turbo pump is a core component in the high vacuum system. By analyzing the structure of SB6 vacuum system and the feature of the turbo pump, the dissertation discusses three matters that probably make the turbo pump to be destroyed easily when doing bonding processes. The software adjustment, which increases the chamber pressure gradually and smoothly by editing the standard bonding program, is finally introduced to improve the gas inlet throughput when chamber purging. It is confident that the idea to protect the turbo pump mentioned in the dissertation will be helpful to those who are doing semiconductor technical service job.
出处 《电子工业专用设备》 2007年第5期29-33,54,共6页 Equipment for Electronic Products Manufacturing
关键词 SB6键合机 分子泵 分子气流 工艺腔净化工艺 SB6 Substrate Bonder Turbo Pump Molecular flow Chamber Purging
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参考文献4

  • 1SUSS SB6 Substrate Bonder Operating Manual Version 1.4 published by Suss Microtec[M],Page 24-26,Nov.2000.
  • 2Working with Turbopumps by Pfeiffer Vacuum[DB/OL].http://www.pfeiffer-vacuum.com/filepool/2/File/PT0053 PE_Working_w_Turbopumps.pdf,Dec 10,2006.
  • 3Understanding Turbomolecular Pumps[DB/OL].http://www.physics.rutgers.edu/ugrad/387/388s06/UHV_LEED/UHV_Pumps.pdf,Dec 12,2006.
  • 4Introduction to Vacuum Technology[DB/OL].http://www.phys.uwosh.edu/rioux/texts/vacuum.pdf,Jan 2,2007.

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