摘要
通孔再流焊技术是将通孔元件结合到表面组装工艺的一种工艺方法,虽然存在不足之处,但是通过适当的工艺设计和工艺过程控制,通孔再流焊焊点质量与可靠性是可以与传统替代工艺相媲美的。
Through hole reflow soldering is a way that combine through hole components with SMT. Although there are many disadvantages, solder joint quality and reliability of THR equal to traditional process instead by controlling design and process properly.
出处
《电子工业专用设备》
2007年第5期34-39,共6页
Equipment for Electronic Products Manufacturing
关键词
强制热风再流焊
通孔再流焊
钎料填充率
剥离
批量挤压式印刷工艺
Forced Hot Air Reflow Soldering
Through Hole Reflow （THR） or Pin In Paste （PIP）
Filling Ratio of Solder
Fillet Lifting
PumpPrinting Technology
