激光选择性烧结钨、铜制作电子线路图形的研究

Investigation on Electronic Circuit Preparation Using Selective Laser Sintering of Copper and Tungsten

为了改进现有电子线路图形制作工艺,应用新型激光烧结技术在陶瓷、高分子材料、半导体以及玻璃等基板上根据需要烧结金属和非金属线条、线路以及图像(如人和动物图案),取得初步研究结果。本技术可用于布线、修复断裂线条和作标记等。这里着重介绍激光烧结技术在陶瓷、高分子等材料上制作钨、铜线条、图形的工艺流程、浆料制作以及金属特性等研究成果。

To improve the production technique for conductive circuits, we use new kind of laser sintering technique to sinter metallic and nonmetallic lines, circuits or pictures （ for example, profiles of people and animals ） on a substrate, such as Al2O3 ceramics, glass, semiconductor or plastics, which might be used for repair of damaged circuits, making of labels or marks, production of electronic circuits, and etc. Here, we will report some research results about the processes and characteristic of tungsten and copper patterns laser sintered on Al2O3 ceramics substrates. It is also introduced that the methods of precursor preparation for the laser sintering.