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n-GaN基Ti/Al/Ni/Au的欧姆接触高温特性 被引量:1

High Temperature Characteristics of Ti/Al/Ni/Au Multilayer Ohmic Contact to n-GaN
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摘要 研究了在高温工作环境下Ti/Al/Ni/Au(15nm/220nm/40nm/50nm)四层复合金属层与n-GaN的欧姆接触的高温工作特性.退火后样品在500℃高温下工作仍能显示出良好的欧姆接触特性;接触电阻率随测量温度的增加而增大,且增加幅度与掺杂浓度有密切关系.掺杂浓度越高,其接触电阻率随测量温度的升高而增加越缓慢;重掺杂样品的Ti/Al/Ni/Au-n-GaN欧姆接触具有更佳的高温可靠性;当样品被施加500℃,1h的热应力后,其接触电阻率表现出不可恢复性增加. The high temperature characteristics of the ohmic contact of Ti/AI/Ni/Au (15nm/220nm/40nm/50nm) multilayer contacts to n-type GaN(Nd =3.7×10^17cm^-3 , Nd=3.0×10^18cm^-3) are studied. The annealed samples still show excellent ohmic contact characteristics at 500℃. Contact resistivity increases with the rise of temperature. Furthermore, the tendency of increase is related to doping concentration:The higher the doping concentration, the slower the increase of the contact re-sistivity with the temperature. Ti/AI/Ni/Au ohmic contact to heavy doping n-GaN has better high temperature reliability. The contact resistivity shows unrecoverable characteristics after the samples are placed under the thermal stress.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2007年第6期984-988,共5页 半导体学报(英文版)
基金 国家高技术研究发展计划资助项目(批准号:2006AA03A112)~~
关键词 欧姆接触 接触电阻率 退火 高温 ohmic contact: specific contact resistivity annealing high temperature
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参考文献8

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