摘要
通过实验测定Sn-Ag-Sb及Sn-Zn-In系列合金的润湿角,进行了润湿性研究,发现Sn-Ag-Sb及Sn-Zn-ln系焊料存在润湿性差的缺点,通过添加低表面张力的金属或稀土元素可在一定程度上降低润湿角,能提高润湿性。
This experiment mensurates the Wetting angle of Sn - Ag - Sb and Sn - Zn - In Lead - free Based Solders. The results indicate that Wetting Ability of Sn - Ag - Sb and Sn - Zn - In lead - free based solders are not very good. But the wetting angle was redused by adding some low surface tension metals or thulium, and this can improve the wetting ability of Sn - Ag - Sb and Sn - Zn - In lead - free based solders.
出处
《电子工艺技术》
2007年第3期135-138,共4页
Electronics Process Technology
基金
云南省科技攻关项目(项目编号:2002gg-ZB07)
