摘要
在半导体材料中,SiC比Si具有更优越的物理特性、化学特性和半导体特性,在高温、高频和功率器件制造中有十分广阔的应用前景.但是它的材料制备很困难.文中在理论分析基础上,以Si为衬底,用常压化学气相淀积(APCVD)技术,在温度为1100℃下,生长出SiC多晶薄膜。
Among semiconductor materials, SiC is superior to Si in physical, chemical and semiconductive properties. SiC has a very bright application prospect for the fabrication of high temperature, high frequency and power devices, but it is difficult to prepare. This paper shows that, based on the theoretical analysis, SiC films have been grown on silicon substrates at the temperature as low as 1 100℃ by the method of atmospheric pressure chemical vapor deposition ( APCVD ) and the samples have been measured and analysed by AES and X ray diffraction.
出处
《西安电子科技大学学报》
EI
CAS
CSCD
北大核心
1997年第1期122-125,共4页
Journal of Xidian University
基金
军事电子预研基金