ZnO陶瓷键合Cu电极技术的研究

Study of the Technique of Bonding Copper to ZnO Ceramic Used as an Electrode

研究了Ｃｕ－ＺｎＯ陶瓷键合技术，并探讨了其作为电极用在线性ＺｎＯ陶瓷电阻器上对器件性能的影响，运用扫描电镜对Ｃｕ－ＺｎＯ陶瓷的键合结构进行了分析，测量了键合Ｃｕ电极后的接触电阻及器件耐电流冲击的稳定性，并与镀Ｃｕ、喷Ａｌ及烧Ａｇ电极进行了分析对比．同时。

The technique of bonding copper to ZnO ceramic used as an electrode has been studied. The influences on the function of liner ZnO resistor by using this electrode are discussed. Bonding structure of Cu ZnO ceramic is investigated by Scanning Electron Microscope (SEM). The contact resistance and the stability of resisting to pulse current for a copper bonded electrode are measured and analysed by comparing with copper plating, aluminium spraying, and silver sintering electrode. The influence on the resistance of ZnO ceramic by the copper bonding technology has also been studied.