甜玉米粒物理性质及其皮渣超细粉碎的研究

Study on the Physical Properties of Sweet Corn Seed and the Superfine Grinding of Peel

分析了甜玉米粒的相关物理属性如球度、千粒重、体积密度、真密度、孔隙率、自由沉降速度等,对甜玉米粒的表皮特性进行了研究,为深入研究玉米工业皮渣超细粉碎提供了可靠的实验数据。

This study was conducted to investigate some physical properties of sweet corn seed relatively, sphericity, kernel weight, bulk density, true density, porosity, terminal velocity, and especially the cuticular property of sweet corn seed, upon which the key technology of the superfine grinding of peel was based in the field of sweet corn comminution processing.