摘要
为了解决MEMS器件真空封装难题,设计并研制了一台将电阻焊与真空系统集成于一体的真空电阻焊机。采用波纹管和高性能密封圈来实现真空密封;采用电木板或聚四氟乙烯等真空泄漏率低的绝缘材料来实现绝缘。有限元分析表明,焊接高温并不会降低初始真空度,在电极上开小螺栓孔对焊接电流分布的影响不大。MEMS器件真空封装试验表明,该装备封装效果良好。
To solve the problem of MEMS vacuum package, vacuum resistance welding equipment, which contains resistance welding and vacuum system, was designed and manufactured. Vacuum seal was achieved by using ripple pipe and high--performance seal ring, By optimization analyses it is found that high temperature of welding does not induce low initial vacuum degree,and holes of bolt on electrode rarely lead to pockcty welding current. The vacuum packaging result of MEMS devices show good effect of this equipment.
出处
《中国机械工程》
EI
CAS
CSCD
北大核心
2007年第11期1265-1268,共4页
China Mechanical Engineering
基金
国家863高技术研究发展计划资助项目(2005AA404260)
