摘要
介绍了IC封装热压模机合模机构的设计过程,建立了合模机构的有限元模型,运用有限元分析软件ANSYS对合模机构的关键部位进行了应力、变形分析,得出了该机构的应力变形分布图,为进一步改进机构的受力情况和结构设计提供了重要依据。
The process of design for clamping unit of auto molding in IC packaging was introduced, and finite element model of clamping unit was established. The stress and deformation of key parts of clamping unit was analyzed by using finite element analysis program ANSYS, and the distribution of the stress and deformation was given. The study results provide an important basis for further improving on the force condition and the structure design of clamping unit.
出处
《机床与液压》
北大核心
2007年第6期41-43,共3页
Machine Tool & Hydraulics
基金
国家自然科学基金(50475044)
教育部科技研究重点项目(2004106)
广东省科技攻关计划项目资助(2005A10403004)
关键词
热压模机
合模机构
有限元分析
IC封装
Auto molding
Clamping unit
Finite element analysis
IC packaging
