纳米Cu^(2+)/TiO_2复合材料的抗菌性能研究

Study on Antibacterial Activity of Nanometer Cu^(2+)/TiO_2 Composite Materials

采用溶胶凝胶法制备了不同掺杂量的纳米Cu2+/TiO2复合材料,研究其无紫外光照射时的抗菌性能.结果表明,n(Cu):n(Ti)=1:50～1:10时,纳米Cu2+/TiO2复合材料无需紫外光照射均具有较强的抗菌性能,对大肠杆菌和金黄葡萄球菌产生透明抑菌圈,直径为6～26 mm.适量掺杂时以催化机理杀菌,过量掺杂时以溶出机理杀菌.

Nanometer Cu^2＋/TiO2 composite materials doped with different content of Cu^2＋ were prepared and their antibacterial activity without UV irradiation was studied. The test results show that the composite materials have excellent antibacterial activity without UV irradiation when n（Cu）：n（Ti） is 1：50 to 1：10. They have clear antibacterial circle of 6-26 mm toward E.coli and S.aureus. Their antibacterial mechanism is photocatalysis when proper amount of Cu^2＋ doped and contacting mechanism when excessive Cu^2＋ added.