新一代晶圆划片技术

Next Generation Wafer Dicing Technology

随着半导体及电子业技术的发展和消费市场无止境的需求,传统的划片(Dicing)技术,在许多方面已经无法满足业者的需求,代之而起的是激光划片(Laser Dicing)技术。而激光固然有某些优势,却亦有其缺陷。无论如何,激光引领划片的潮流,来势汹汹,难以抵檔。

With the development of semiconductor and electronic technologies and the increasing demand of consumption market, the conventional dicing technology can＇t meet the challenges and requirements in many ways. Thus, laser dicing technology is booming. Though it has some advantages, there still exist some problems. Anyway, it＇s a trend that laser dicing will become the main stream of the next generation wafer dicing.