摘要
在６０／４０的锡铅焊料中加入０２％左右的铜，凝固后具有均匀细小的共晶组织，其熔点为１８３℃，焊点强度、扩展率及可靠性均比无铜的６０／４０的锡铅焊料高，并且含铜的锡铅焊料在焊接时，对铜烙铁头和微细铜丝具有最小的熔蚀性。
With trace contents of 02% Cu added into HLSnPb40 Soldering material,a new type of alloy is developed in this paper.The microstructure of the alloy is small eutectic.The melting point is 183 ℃,the strength and the spread percentage of soldering point are higher than that of HLSnPb40 Soldering materials.And the soldering wire containing Copper is of very little erosion effect on the copper head of soldering iron and thin copper wire.
出处
《四川工业学院学报》
1997年第1期9-13,共5页
Journal of Sichuan University of Science and Technology
关键词
焊锡丝
铜
熔蚀性
合金组织
锡铅焊料
焊接性能
soldering wire
copper
erosion effect of melting
structure of alloy
