摘要
采用铜基合金钎料,适当控制钎焊工艺,实现了金刚石与钢基体的高强度连接。借助扫描电镜(SEM)、X射线能谱(EDS)、X射线衍射(XRD)分析了真空加热条件下,对铜基合金钎料与金刚石之间的界面反应,钎焊面进行了表面形貌和结构分析。探讨了钎料与金刚石界面处碳化物的形成机理。阐明了在钎焊过程中Ti元素在金刚石界面形成富Ti层并与金刚石表面的C元素反应生成TiC、SnTi C是实现合金层与金刚石有较高结合强度的主要因素。钎料与钢基体在钎焊温度下发生组元间相互扩散,形成了固溶体及其化合物,从而实现钎料与钢基体的高强度结合,并对一系列铜基钎料进行了测试。
The high-strength bonding between diamond grit and steel matrices was realized by using a Cu-based alloy under controlled brazing conditions. The interface between the Cu-based alloy and diamond grit was analyzed by using scanning electronic microscopes and X-ray diffraction. The formation mechanism of carbide layers was discussed. Testing results show that the Ti element in the alloy is accumulated onto diamond surface and reacts with C element the surface to form all TiC layer. As a result, metallurgical bonding is produced between the alloy and the diamond grit.
出处
《金刚石与磨料磨具工程》
CAS
北大核心
2007年第3期26-28,共3页
Diamond & Abrasives Engineering
关键词
金刚石
钎焊
化学冶金结合
diamond grit
brazing
metallurgical bonding
