摘要
基于简单的大功率LED器件的封装结构,利用ANSYS有限元分析软件进行了热分析,比较了四种不同界面材料LED封装结构的温度场分布。同时对纳米银焊膏低温烧结和Sn63Pb37连接时的热应力分布进行了对比,得出纳米银焊膏低温烧结粘接有着更好的热机械性能。
Based on a simple-structure package, thermal analysis with ANSYS software for high-power LED was presented. Temperature fields of different interface materials were compared. Compared with thermal stresses fields of low-temperature nanosilver sintered paste and Sn63Pb37 interface materials. The result showed that the novel low-temperature nanosilver sintering technology had better thermomechanical properties.
出处
《电子与封装》
2007年第6期8-12,48,共6页
Electronics & Packaging
基金
国家杰出青年基金-海外青年学者合作基金(50528506)
高等学校学科创新引智计划资助(B06006)
关键词
大功率LED
界面材料
热分析
热应力
纳米银焊膏低温烧结
high-power LED
interface materials
thermal analysis
thermal stress
low-temperature nanosilver sintering
