摘要
在设计陶瓷封装集成电路芯片的焊盘时,需要考虑到引线键合工艺对芯片焊盘设计的一些要求,诸如焊盘尺寸、焊盘布置、焊盘间距、焊盘引出金属条、焊盘到周围布线或元件间的距离等。文中对这些设计给出了一些参考数据。
The layout of die pad, pad size, pad pitch and the distance from pading to the metal line or nearest device should all be considered when designning ceramic package using wire-bonding technology. The design methods is discussed in detail and some reference data is also provided in this article.
出处
《电子与封装》
2007年第6期13-17,共5页
Electronics & Packaging
