摘要
用无铅焊料取代现有的含铅焊料已经成为历史发展的必然趋势。Sn-Ag-Cu系合金具有优异的可靠性和可焊性,受到了电子工业界的广泛关注。阐述了近年来该系焊料合金的微观组织和性能的一些研究成果,并对该系无铅焊料的特性进行了比较。结果表明,低银焊料的组织和性能比高银焊料好,而且成本低,为确定综合性能最佳的该系焊料合金提供依据。
Lead-containing solders have been used in attaching components and printed circuit boards （PCBs） in electronics industry due to their unique characteristics of excellent economical efficiency, practicability and reliability that are well suited for electronics applications. However, over lead ending up in landfill would contaminate land and water supplies, and over lead would resist recycling Operations, it is inevitable that lead-containing solders must be replaced by lead free solder. The electronics industry begins to focus upon the tln-silver-copper system alloys as they have the advantages of good reliability and good solderability. A review of the research development of microstructures and properties of tin-silver-copper system alloys in recent years is made. It shows no advantages in terms of processing, reliability, or availability for the high-silver alloys as compared to the low-silver alloys. The result could provide the basis for selecting the optimal solder alloy in this system.
出处
《理化检验（物理分册）》
CAS
2007年第6期279-281,共3页
Physical Testing and Chemical Analysis(Part A:Physical Testing)
基金
福建省科技专项经费(2005F5009)
关键词
无铅焊料
微观组织
性能
Pb-free solder
Mierostrueture
Property
