确定卡环嵌入式接口线切割轨迹的画法几何方法研究

Descriptive Geometry Methods for Determining the Track of Wire Incision to Embed Cut of Ring

提出了确定嵌入式三维接口线切割轨迹的画法几何方法。在AutoCAD软件环境下,建立卡环的几何模型,用三视图和画法几何方法优化线切割平面,用电脑扫描的方法测量线切割平面的位置和角度尺寸。研究表明,对于Φ100卡环,保证完全根切、不留残余根高的线切割平面P1最大偏角是35°,清根距离为3.25mm;保证凹端上部强度的最小偏角是24°,清根距离为3.69mm;线切割平面P1的偏角应该在24°～35°之间。虚拟加工绝对误差小于0.02mm,相对误差小于0.6%,可以在线切割加工中应用。

A descriptive geometry method is presented to obtain the track of wire incision in processing the three dimensional cut. Firstly, the geometry model of the ring is determined, and the planes for wire moving are positioned and optimized by applying three basic views based on the principle of descriptive geometry. Then, the linear and angle dimension used for cutting are measured by means of computer scanning based on AutoCAD software. The results show that the maximum angle of plane P1 formed by moving Mo wire is 35° and the moving distance of Mo wire on next upright direction is 3.25mm for cutting the rest part of incision to obtain a perfect one. Secondly, the least minimum angle of plane P1 is 24° and the moving distance of Mo wire is 3.69mm to get a cut with satisfying intensity. It is concluded that the angle of plane P1 should be recommended between 24° and 35°, and the virtual process is acceptable in the wire incision technology because its absolute difference is less than 0.02mm, the relative does not more than 0.6%.