摘要
SOI(SilicononInsulator)技术被认为是21世纪的硅集成电路技术.近年来,国际上出现了一种引人注目的SOI制备新技术———智能剥离(Smartcut)技术.它的出现为解决SOI技术中质量与价格的矛盾带来了新的希望,将会有力地推动SOI技术的进一步发展.文章简要回顾了目前存在的几种SOI制备技术。
Silicon on Insulator(SOI) technology is considered as the future of microelectronics. Smart cut technology is a novel fabrication method which can produce SOI materials of high quality at low expense. In this paper the main types of SOI technology are described, with reference to our own work. The smart cut method is discussed in detail.
出处
《物理》
CAS
1997年第3期155-159,共5页
Physics