微力微位移天平测试方法

Measurement of Small Load and Displacement Using Balance

介绍了一种简单有效的微力、微位移天平测试方法,通过对薄型硅悬臂梁进行力—挠度特性测试进而提取材料杨氏模量的方法是简便、可行的。还介绍了用于测量薄膜应力的悬臂梁挠曲法,对于硅上热生长1.1μm SiO_2的结构,测得SiO_2膜内的压应力为200～230MPa.微力微位移天平测试方法操作方便,仪器成本低,具有较高精度。

A simple and effective method using a balance to measure a very small load and its corresponding displacement is presented. The method is proved to be practicable by testing the load-deflection behavior of silicon cantilever and then the Young's modulus can be calculated. Cantilever-diflection method used to measure the stress in thin film is also described. The compressive stress in thick ness of 1. 1 μm SiO2 film thermally grown on silicon substrate is found to be 200-230 MPa. The balance-method to measure small load and displacement is very attractive for its easiness in operation, low cost of the apparatus and high precision.