期刊文献+

高速多芯片组件同步开关噪声的二维特征法全波分析 被引量:4

FULL WAVE ANALYSIS OF SIMULTANEOUS SWITCHING NOISE IN HIGH SPEED MCM BY THE METHOD OF CHARACTERISTICS
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摘要 高速多芯片组件(MCM)广泛用于高复杂度的系统中,而其中的同步开关噪声(Simultaneous Switching Noise)是影响系统功能的重要因素.本文采用二维电磁模型模拟MCM电源、接地板同步开关噪声;文中提出一种新的时域电磁问题的数值方法—特征法,并用于求解上述问题,所得结果与FD-TD计算的结果和文献报道一致. High speed Multi-Chip Module (MCM) has been widely adopted in the complex system, where simultaneous switching noise is one of the key factors affecting the system function. In this paper, two dimensional electromagnetic model is used to simulate power/ground plane simultaneous switching noise in MCM. A novel numerical method for the time-domain electromagnetic problems, named method of characteristics, is presented and used to solve the above problem. The results obtained are in accordance with that by the method of FD-TD and that reported by literature.
出处 《电子科学学刊》 CSCD 1997年第4期510-515,共6页
关键词 多芯片组件 同步开关噪声 CMOS 集成电路 Multi-chip module, Simultaneous switching noise, Method of characteristics
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参考文献3

  • 1Chen Y,1994 IEEE Multi-Chip Module Conference,1994年
  • 2Fang J,IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging,1993年
  • 3团体著者,偏微分方程数值解法,1979年

同被引文献16

  • 1Guang Tsailei,IEEE Trans MTT,1999年,47卷,5期,562页
  • 2Guang Tsai,IEEE Trans Instrument Measurement,1995年,44卷,2期,300页
  • 3Shen Lin,IEEE Trans CAS,1992年,39卷,11期,879页
  • 4Guang T L,IEEE Trans MTT,1999年,47卷,5期,562页
  • 5Guang T L,IEEE Trans Instrumentation Measurement,1995年,44卷,2期,300页
  • 6李征帆,毛军发.微波与高速电路理论[M].上海:上海交通大学出版社,2004.1-30.
  • 7Y Chen,Z Wu,A Agrawal.Modeling of delta-I noise in digital electronics packaging[A].1994 IEEE Multi-Chip Module Conference[C].Denver,1994.126-131.
  • 8S Chun,M Swaminathan,L D Smith.Modeling of simultaneous switching noise in high speed systems[J].IEEE Trans on Advanced Packaging,2001,24(2):132-142.
  • 9A E Ruehli.Equivalent circuit models for three-dimensional multiconductor systems[J].IEEE Trans on Microwave Theory and Techniques,1974,22(3):216-220.
  • 10J Choi,S H Min,J H Kim.Modeling and analysis of power distribution networks for gigabit applications[J].IEEE Trans on Mobile Computing,2003,2(4):299-313.

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