摘要
介绍了MOEMS加速度地震检波器中敏感元件——简谐振子的工作和设计原理,并详细讨论了影响简谐振子腐蚀质量的因素.在实验中采用硅各向异性腐蚀法,制作出了高精度的硅微简谐振子.改进浓度配比的腐蚀液,在80℃时,腐蚀速率控制在(0.53±0.2)μm.测试结果表明:SiO2控制精度达到0.1μm,可应用于光电集成加速度地震检波器的集成光学器件中.
The principle of operation and design of the harmonic oscillator was introduced and the factors influencing the etching quality of the harmonic oscillator were analyzed in detail. In experiment, the fabrication technology was studied and improved to get the high quality of harmonic oscillator. At 80℃, the etching velocity of the improved etching liquid was controlled in （0.53 ± 0.2）μm range.The testing result indicates that the control precision of SiO： is 0.1 μm, which can be applied in the integrated optical chip of the photoelectric integrated acceleration seismic geophone.
出处
《纳米技术与精密工程》
EI
CAS
CSCD
2007年第2期117-120,共4页
Nanotechnology and Precision Engineering
基金
国家自然科学基金资助项目(40274047)
中国博士后科学基金资助项目(2005038468)
关键词
微光机电系统
简谐振子
优化设计
腐蚀
micro-optic-electro-mechanical-system （MOEMS）
harmonic oscillator
optimum design
etching
