不同邻对位比值的酚醛树脂固化行为研究

Curing Behavior of Novolac-type Phenolic Resin with Varying O/P Ratios

通过DSC研究了不同邻对位比值（O／P值）的酚醛树脂与六亚甲基四胺的固化反应行为。DSC测试表明，DSC固化曲线的峰顶温度随着升温速率的增加而升高，在同一升温速率下，酚醛树脂固化曲线的初始温度（Ton）及峰顶温度Tp均随着其O／P值的增加而降低。进一步分别利用（Dzawa和Kissinger方法求解了不同O／P值酚醛树脂的固化反应活化能，发现酚醛树脂的固化活化能随其O／P值的增加而降低，表明随着树脂O／P值的增加，其固化进程变得更加容易，固化速率更快，与之对应，树脂的最佳固化温度区间随O／P值的增加而向低温方向移动。

Curing behavior of varying O/P ratio phenolic resins was studied by differential scanning calorimetry （DSC） method. DSC results showed that the top temperature of DSC curve increased with the increasing heating rate. The onset and top temperature of DSC curve reduced with increasing O/P ratio at the same heating rate. The activation energy values of the varying O/P ratio phenolic resins were investigated with Ozawa and Kissinger＇s methods. It was found that the activation energy values of phenolic resins reduced with increasing O/P ratio. In general, lower activation energy values indicated that the reaction proceeded faster at a given temperature, and needed less heat and lower temperature. Therefore, the higher the O/P ratio was, the lower curing temperature and the faster curing rate were for the curing reaction.