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Sn-Zn基无铅焊接材料的界面反应和润湿性能 被引量：2

Interface reaction and wettability of the Sn-Zn based lead-free solder alloys
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摘要 总结了近年来Sn-Zn基与不同成分基板的界面反应的研究现状,概括了界面反映的主要生成物是Cu6Sn5和Cu5(Zn,Sn)两种化合物.同时总结了提高Sn-Zn基无铅焊料润湿性能所作的工作,指出在添加剂中加入金属有机物可能会成为提高焊料润湿性能的一个途径. Interface reaction between Sn--Zn based lead--free solders and Cu substrate was Discussed, Cu6Sn5 and CuS（Zn, Sn）compound was revealed to formed in the Interface for most Sn--Zn based lead--free solders. Work on the improving the wettability of the Sn--Zn based lead--free solders was summary , and that flux adding metal--organic addition was addressed to be a way improving the wettability of the solder .
作者 梁建烈 谢世标 唐轶媛
机构地区 广西民族大学物理与电子工程学院
出处 《广西民族大学学报（自然科学版）》 CAS 2007年第2期83-86,101,共5页 Journal of Guangxi Minzu University ：Natural Science Edition
基金 广西科学基金资助项目(0448022)
关键词 Sn-Zn基合金 无铅焊料 润湿性能 Sn-- Zn based alloy interface reaction wettability
分类号 TG111 [金属学及工艺—物理冶金]
  • 相关文献

参考文献22

  • 1[1]Huang L.;Wang Q.;Ma J.SH.The study on the novel leadfree solder alloy[J].Electron.Mater.and Pack.,2000:191-193.
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同被引文献21

  • 1杜长华,陈方,杜云飞.Sn-Cu、Sn-Ag-Cu系无铅钎料的钎焊特性研究[J].电子元件与材料,2004,23(11):34-36. 被引量：35
  • 2王旭艳,薛松柏,禹胜林,朱小军.温度与镀层对Sn-Ag-Cu无铅钎料润湿性的影响[J].焊接学报,2005,26(10):93-96. 被引量：12
  • 3卢斌,栗慧,王娟辉,张宇航.添加微量稀土元素对Sn-Ag-Cu系无铅焊料性能的影响[J].稀有金属与硬质合金,2007,35(1):27-30. 被引量：14
  • 4TU K N,ZENG K. Tin-lead (SnPb) solder reaction in flip chip technology[R]. Lausanne: Elsevier Science, 2001.
  • 5ZENG K,TU K N. Six cases of reliability study of Pb-free solder joints in electronic packaging technology[J]. Mater Sci Eng Rep, 2002,38(2):55 - 105.
  • 6ABTEW M,SELVADURAY G. Lead-free solders in microelectronics [J ]. Mater Sci Eng Rep, 2000, 27 (5 - 6):95 - 141.
  • 7GREEN S, LEA D, HUNT C. Solderability measurements with lead-free alloys[R]. Teddington:NPL Report CMMT(A)213, 1999.
  • 8WANG H Q, WANG F J, GAO F, et at. Reactive wetting of Sn0. 7Cu-xZn lead-free solders on Cu substrate[J]. Journal of Alloys and Compounds, 2007,433( 1 - 2) :302 - 305.
  • 9WANG Y W,CHANG C C,KAO C R. Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth[J]. Journal of Alloys and Compounds, 2009,478(1 - 2) :L1 - L4.
  • 10WANG Y W, LIN Y W,TU C T,et al. Effects of minor Fe,Co, and Ni additions on the reaction between SnAgCu solder and Cu[J]. Journal of Alloys and Compounds,2009,478( 1 - 2) : 121 - 127.

引证文献2

二级引证文献6

广西民族大学学报（自然科学版）
2007年 第2期

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