摘要
文章主要在于明确可焊性、焊接能力和焊点可靠性三者之间的联系和区别,指出对它们进行评估和测试时其各自关注的主要特性和常见的评估和测试方法,同时简单介绍影响它们的关键因素。
The objective of the article is to clearly describe the relation and difference among solderability, soldering ability and solder joints reliability and point out the corresponding characteristics when evaluating and testing these items. Usual evaluating and testing methods are briefly introduced and the critical factors to the items are also briefly discussed.
出处
《印制电路信息》
2007年第7期60-63,共4页
Printed Circuit Information
关键词
可焊性
焊接能力
焊点可靠性
solderability
soldering ability
solder joints reliability
