摘要
提出了一种具有“双材料梁-微镜一体化”特征结构的光读出红外成像阵列器件。该特征结构集成了红外敏感、调制和输出读出可见光信号的双重功能。通过研究相关性能,完成了像素单元尺寸的优化设计。理论计算表明,其关键性能指标的热-机械灵敏度和噪声等效温差分别为2.14×10-3rad/K和2.94 mK。
A novel optically readable infrared imaging array device with "bi-material beam micro-mirror integrated structure" pixels has been proposed. The integrated structure pixel not only is sensitive to infrared radiations, but also can modulate and output readable visible light. The geometric parameters of the integrated structure have been designed and optimized by investigating some relative performances. Thermal-mechanical sensitivity and NETD of the device designed are estimated as 2.14×10^-3 rad/K and 2.94 mK, respectively.
出处
《半导体光电》
EI
CAS
CSCD
北大核心
2007年第3期327-330,337,共5页
Semiconductor Optoelectronics
基金
国家自然科学基金资助项目(60407013)
上海应用材料研究与发展基金资助项目(065A04)
关键词
双材料梁-微镜一体化
热-机械灵敏度
热时间常数
噪声等效温差
光读出红外成像阵列器件
bi-material beam micro-mirror integrated structures
thermal-mechanical sensitivity
thermal time constant
noise equivalent temperature difference(NETD)
optically readable infrared imaging array device