集成电路用铜基引线框架材料的发展与展望

Development and Expectation of Copper-based Lead Frame Material Used in Intergrated Circuit

综述了集成电路对铜基引线框架材料的性能要求,指出好的导电导热和强度性能是引线框架材料最主要的性能要求;讨论了铜基引线框架材料的国内外研究现状,指出我国的引线框架材料无论是质量还是数量都与其他工业发达国家有很大的差距,并指出微合金化铜基材料具有成为高强高导引线框架材料的潜力。

In this paper, the property requirements of copper-based lead frame material used in intergrate cir cuit are reviewed, and the uppermost requirement being electricity conductivity and strength is pointed out. The actuality of research of copper-based lead frame material at home and abroad is described. The gap of lead frame material between our country and other industry developed countries in quality and quantity is pointed out. And it＇s pointed out that the micro alloying copper-based material will be likely to become the development direction of high strength and high conductivity lead frame material.