摘要
弥散强化铜基材料是一类具有优良综合性能的新型结构功能一体化材料,综述了弥散强化型导电铜基复合材料的理论研究进展、国内外的应用,以及近年来该材料制备方法的研究新进展,总结了该类材料的主要复合体系,指出解决增强相粉体的细化及增强相与基体铜之间的界面适配性问题是该类材料发展的关键性技术。
Dispersion hardening copper matrix composite materials (DSC) are a series of high strength and high conductivity copper based alloys. In this paper, the theory study and application of DSC materials are reviewed. The new developments of the fabrication processes of the materials are reviewed in detail. The main composite systems of the DSC materials are summarized. The size of dispersion phase and the matching of interface of the dispersion phase and copper matrix are pointed out as the key technologies of the DSC materials. It is point out that the key technologies of the DSC materials are the size of dispersion phase and the matching of interface of the dispersion phase and copper matrix.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2007年第7期27-31,35,共6页
Materials Reports
基金
甘肃省自然基金资助项目(3ZS061-A25-038)
兰州理工大学特色研究方向梯队资助项目
关键词
弥散强化
导电率
铜基复合材料
dispersion hardening, conductivity, copper matrix composites