摘要
对环氧模塑料的性能和封装成型工艺的选择作了详细的分析和研究,同时介绍了环氧摸塑料目前的应用发展趋势。
The properties and the choices of molding teehnology in paekaging of epoxy molding eompound are analyzed and studied in detail, and the eurrent developing trend of the applieation of epoxy molding eompound is reviewed.
出处
《塑料工业》
CAS
CSCD
北大核心
2007年第B06期67-68,83,共3页
China Plastics Industry
关键词
环氧模塑料
成型工艺
集成电路
塑料封装
Epoxy Molding Compound
Molding Teehnology
Integrated Circuit
Plasties Packages
