摘要
为有效发现手机壳体的设计缺陷,运用HyperMesh和LS-DYNA软件仿真手机自由跌落,分析不同圆角半径的设计对手机壳体强度和刚度的影响.仿真和分析结果可以为手机壳体圆角半径设计提供参考.
To find out the design defects of mobile phone shell efficiently, HyperMesh and LS-DYNA are used to simulate the free drop of mobile phone. The effect of different round radius to intensity and rigidity of mobile phone shell is analyzed. The simulation and analysis results can provide references for round radius design for mobile phone shell.
出处
《计算机辅助工程》
2007年第2期48-51,共4页
Computer Aided Engineering
基金
江苏省自然科学基金(BK2004073)
