火场中釉面内墙砖显微结构的扫描电镜分析

SEM analysis of microstructure of ceramic tiles in fire scene

应用扫描电子显微镜对经历不同火场温度和冷却方式的釉面内墙砖的显微结构进行了观察和分析。结果表明,在不同受热温度和冷却方式条件下,釉面内墙砖的显微结构会发生改变。当温度达到300℃,冷却试验时,釉面可产生裂纹,但显微结构基本无变化;当温度达到900℃,冷却试验时,釉面出现熔化现象,坯体晶体结构酥裂、破碎,完整性遭到破坏,强度基本丧失。

The microstructure of ceramic tiles undergoing different temperatures in fire scene was analyzed using scanning electron microscope （SEM）. The results showed that the microstructure of ceramic tiles varied with different heating temperatures and cooling methods. When heating temperature reached 300℃, crackings appeared on the surface of ceramic tiles but the microstructure of glaze exhibited no apparent change; when heating temperature reached 900℃, the glaze melted, the crystal structure of the tiles broke down, the integrity of ceramic tile was destroyed and the intensity was almost lost.